R1 ULTIMATE
Research in Performance
Perfection in Details
The Apex of Air Cooling Technology
Full Contact Enhanced Performance
Patented DirectCompress Soldering, increases the actual contact surface between the heatpipe and heatsink fins. DirectCompress Soldering has up to 10% more contact surface compared to traditional soldering, and the more contact surface the faster the heat conduction.
Spreading Out and Making Room
On aluminum sheets, heat spreads out in a radial direction. By displacing the heatpipe alignment on the heatsink fins, our Heatsink Displacement Optimization allows for better and more evenly spread heat conduction on the fins compared to traditional linear alignment.
Accelerated Air ExhaustThe Faster the Cooler
The individual tower stack is separated into two sections, the loose air intake and the high density exhaust section. By the laws of fluid dynamics, the increase in fin count in the exhaust section squeezes airflow and increases exhaust air speed. The increase of airflow speed in our Jet Fin Acceleration System allows heated air leave the tower faster.
Optimized Heatpipe Positioning Total CPU Coverage
The R1s Heatpipe Convex-Align System allows for more heatpipes in a given area, optimized heatpipe placement in the copper base, and improved alignment with your CPU. With the Heatpipe Convex-Align System, each heatpipe functions to their maximum TDP capacity.
Kill the Noise Silence is Cold
Acoustics are just as important as performance. Thats why the XF140 140mm fan integrates acoustic optimizations. The XF140 features our High Precision Low Noise (HPLN) Bearing and the detachable Acoustic Vibration Absorbers that give the fan a snugger fit while canceling vibration and noise at the same time.
- HEATSINK SPECIFICATION
- Dimension (with fan): L142.4 mm x W140 mm x H168.3 mm
- Weight ( with fan ): 1282 g
- Weight ( without fan ): 970 g
- Heat pipes: 6mm heatpipe x 7 units
- Front Fin: T = 0.4 mm ; Gap = 2.4 mm
- Front Fin Pcs: 42 pcs
- Rear Fin: T = 0.4 mm ; Gap = 1.8 mm
- Rear Fin Pcs: 53 pcs
- Copper Base: C1100 Pure copper nickel plated
- Distance From Center: 40 mm
- RAM Height Limit: 30 - 35 mm ( Fan position adjustable )
- TDP: 250 W+
For Intel™ LGA1700 socket add Cryorig LGA 1700 KIT Type-A